The advent of 300 mm technology added a substantial volume of plastic to the fab environment through the use of front opening unified pods or FOUP’s. While it is recognized that additional fire risk may result from this added volume of material, some controversy exists as to the significance of the risk imposed. How much plastic is too much? Now there’s a realistic way to measure the risk.

We know that your interests are best served by predicting outcomes associated with risk. Our new fire risk modeling technique gives you that capability. This system, called the ARC-Fire Methodology™ (Assessment of Risk for Carrier Fires Methodology) is designed to weigh the risks associated with the use of large plastic wafer carriers utilized in the semiconductor industry. These FOUP’s are greater than one cubic foot in size and may or may not be made of fire resistant materials. They may number in the hundreds in an operating wafer fabrication facility. The sheer volume of fuel introduced into the semiconductor-manufacturing environment by these carriers has created significant challenges. Defining the risk has perhaps been the greatest challenge.

We know there is nothing more frustrating for companies and their insurers to clash over risk and how to reduce it. We have solid advice that is quantifiable. The ARC-Fire System™ assists the evaluator in identifying corrective actions during the assessment. Our system and service gives realistic results helping manufacturing companies, insurers and local code authorities to accurately assess risk and determine what cost effective mitigation efforts can be employed. Our proprietary system examines the relevant factors to quantify risk but also fully accounts for existing risk mitigation designs, systems and efforts.